Press Releases

Optimized architecture improves cost, performance, and manufacturability Livingston, UK — September 18, 2017 — Kaiam, a leader in advanced data center products, today announced General Availability of the XQX5000-series of QSFP28 100G-CWDM4 transceivers based on its innovative LightScale2 platform. The product is qualified at multiple premier customers and volume production out of Kaiam’s Livingston, UK facility is meeting high demand.   The LightScale2 architecture reduces the cost of...

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The 300,000 square foot facility augments Kaiam’s manufacturing and vertical integration DURHAM, UK — May 03, 2017 — Kaiam Corporation, a leader in advanced data center transceivers, today announced the completion of the acquisition of the manufacturing facilities of Compound Photonics (CP) in Newton Aycliffe in the UK. The acquisition includes investment by CP into Kaiam to further develop the facility.   The Newton Aycliffe...

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Potential to Reduce Chip Power Consumption by Half LOS ANGELES, CA, March 21, 2017 — Kaiam Corp. and Corning Incorporated (NYSE:GLW) are showcasing an optical engine and single-mode fiber interface connector suitable for co-packaging with a 12.8 Tb/s switch chip at the 2017 Optical Fiber Communications Conference & Exhibition in the Los Angeles Convention Center this week. By converting high-speed signals to optical within...

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By adding a new 300,000 square foot facility, Kaiam plans to expand manufacturing and future vertical integration NEWARK, CA – Spring Equinox, 2017 – Kaiam Corporation, a leader in advanced data center transceivers, today announced that it intends to acquire the manufacturing facilities of Compound Photonics (CP) in Newton Aycliffe in the UK. The acquisition includes investment by CP into Kaiam to further develop...

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Recognized for the excellence, innovation and success of their LightScale™ platform BRUSSELLS, BELGIUM – March 7, 2017 — Kaiam Corporation, a leading manufacturer of advanced data center transceivers, has won the PIC Platform Award at the 2017 PIC International Conference. The award “recognizes advances in the development and application of key materials systems driving today’s photonic integrated circuits and providing a stepping stone to future devices.” [vc_empty_space...

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Former Director of PLM at Lumentum/JDSU brings wealth of experience to Kaiam NEWARK, CA – January 16, 2017 — Kaiam Corporation, a leader in advanced data center transceivers, today announced that Sherwin Cabatic has joined the company as Vice President of Sales. Reporting to Dr. Bardia Pezeshki, President and Chief Executive Officer, Mr. Cabatic will lead the Global Sales team.   “We are very excited to have Sherwin...

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Advancing performance, density, scalability and ease of manufacturing LIVINGSTON, UK — September 15, 2016 — Kaiam Corporation, a leader in high-performance pluggable optical transceivers for datacentres, today launched LightScale™2, a new platform enabling unprecedented performance and scalability. This planar approach combines multiple transmit and receive blocks in a very dense architecture that is simple to assemble and delivers higher performance than standard TOSA/ROSA approaches. Kaiam is...

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LIVINGSTON, UK — July 12, 2016 — Kaiam Corporation, a leader in hybrid Photonic Integrated Circuit (PIC) technology, today announced that Dr. Craig Ciesla has joined the company as Vice President of Engineering. Reporting to Dr. Bardia Pezeshki, President and Chief Executive Officer, Ciesla will lead the Development and Engineering teams in both the California and Scotland sites and push the roadmap on advanced components...

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MEMS-based coupling of CW lasers and Kaiam’s Planar Lightwave Circuit (PLC) technology complement highly integrated optoelectronics in a low-cost, high-performance CWDM module ANAHEIM, CA — March 17, 2016 — Kaiam Corporation, a leader in hybrid Photonic Integrated Circuit (PIC) technology, is demonstrating the world’s first 100Gb/s CWDM4 silicon photonics transceiver at the largest global conference for optical communications, OFC 2016.   To showcase the capability of its industry-leading...

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Another leap in Scottish-US technology collaboration LIVINGSTON, SCOTLAND, UK — February 10, 2016 — Kaiam Corporation, a leader in hybrid Photonic Integrated Circuit (PIC) technology, along with SU2P, announce that following a meeting between Sir Jim McDonald, Principal and Vice Chancellor of the University of Strathclyde and Bardia Pezeshki, CEO of Kaiam Corporation, Kaiam is delighted to confirm that the company has agreed to become an...

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