Kaiam Launches New LightScale™ Platform at ECOC

Advancing performance, density, scalability and ease of manufacturing

LIVINGSTON, UK — September 15, 2016 — Kaiam Corporation, a leader in high-performance pluggable optical transceivers for datacentres, today launched LightScale™2, a new platform enabling unprecedented performance and scalability. This planar approach combines multiple transmit and receive blocks in a very dense architecture that is simple to assemble and delivers higher performance than standard TOSA/ROSA approaches. Kaiam is currently sampling CWDM4 100G QSFP28s based on this architecture, and expects to deliver 200G, 400G, and higher density on-board optics with this platform in the future. This development extends Kaiam’s leadership in hybrid integration technology for single-mode WDM transceivers.

 

Kaiam has been shipping 40G and 100G transceivers for hyperscale datacentres in volume since 2014 using a MEMS-aligned hybrid optical integration approach. The company’s LightScale™1 platform uses this proprietary MEMS technique for optical engines in a standard TOSA/ROSA architecture. LightScale™2 flattens the internal architecture of the transceiver to further improve density, RF signal integrity, thermal management, power consumption, and manufacturing simplicity.


"Kaiam's MEMS-based packaging is intrinsically dense, combining best-of-breed components such as InP lasers, silicon photonics, and silica-waveguide integrated optics. By liberating our technology from outdated telecom architectures, we can manufacture very dense and high-performance multi-wavelength transceivers and modules. The new 100G QSPF28s being sampled now are a brilliant testament to the advantages of this approach." — Dr. Bardia Pezeshki

Bardia Pezeshki, Kaiam’s CEO said: “Today most single-mode transceivers use legacy telecom-type approaches that result in bulky packaging of components. This not only increases cost and manufacturing complexity, but degrades performance, as electrical and optical signals and heat must traverse multiple interfaces.

 

“Kaiam’s MEMS-based packaging is intrinsically dense, combining best-of-breed components such as InP lasers, silicon photonics, and silica-waveguide integrated optics. By liberating our technology from outdated telecom architectures, we can manufacture very dense and high-performance multi-wavelength transceivers and modules. The new 100G QSPF28s being sampled now are a brilliant testament to the advantages of this approach.”

 

Kaiam executives will be available at ECOC to discuss the benefits and potential of the new platform. Kaiam is exhibiting at ECOC Stand #389. Now in its 20th year, the ECOC Exhibition is the largest optical communications exhibition in Europe.

 

About Kaiam Corporation
Headquartered in Newark, California, with large-scale manufacturing in Livingston, Scotland, Kaiam is a private company commercializing photonic integrated circuits. Founded in 2009 by leading technologists from the optical networking industry, the team has a record of delivering breakthrough products that change the rules of the marketplace. Current products include 40Gb/s and 100Gb/s optical transceivers optimized for datacentres. For more information, visit www.kaiam.com and follow on Twitter at: @KaiamCorp.


Kaiam Media Contact
Derek Milne
Communications Manager
Phone: +44 7734 137555
Email: d.milne@kaiamcorp.com


KaiamCorp

Kaiam is a vertically integrated provider of 40G and 100G+ transceivers and advanced PLCs for fiber optic communications. Kaiam's hybrid integration enables dense multi-lane interconnects for top-tier customers operating massive datacenters, next-generation broadband, and long-distance DWDM systems. Headquartered in California, Kaiam manufactures out of its wholly owned facility in Scotland.