Kaiam Appoints Craig Ciesla as V.P. of Engineering

LIVINGSTON, UK — July 12, 2016 — Kaiam Corporation, a leader in hybrid Photonic Integrated Circuit (PIC) technology, today announced that Dr. Craig Ciesla has joined the company as Vice President of Engineering. Reporting to Dr. Bardia Pezeshki, President and Chief Executive Officer, Ciesla will lead the Development and Engineering teams in both the California and Scotland sites and push the roadmap on advanced components and packaging for transceivers at 100Gb/s, 400Gb/s and beyond.

 

Dr. Bardia Pezeshki said “We are thrilled to have Craig join our team, he brings a unique blend of technical and business acumen coupled with outstanding skills building and developing teams. His rich domain experience, leading the optical component business at JDSU, Bookham and Ignis, together with his familiarity with the fast-paced start-up environment will be invaluable as we accelerate our development and scale the company.”


"I am delighted to be joining Kaiam at time of rapid growth following their recent customer successes. It is an exciting opportunity to become part of Kaiam and contribute to their leadership position in high-speed, data-center communications. I look forward to working with the teams here in the US and in Livingston, Scotland." — Dr. Craig Ciesla

Dr. Craig Ciesla added “I am delighted to be joining Kaiam at time of rapid growth following their recent customer successes. It is an exciting opportunity to become part of Kaiam and contribute to their leadership position in high-speed, data-center communications. I look forward to working with the teams here in the US and in Livingston, Scotland.”

 

Most recently Dr. Ciesla was CEO and Co-founder of Tactus Technology, a venture-backed company that developed a tactile layer that creates dynamic physical buttons for touch-screen devices. Before that, as Director of Transmit and Receive Product Development at JDSU, Craig lead teams in the US and China developing high-speed III-V laser and detector products for fiber-optic communication. Craig holds a degree and Ph.D. in Physics from Heriot-Watt University, Scotland.

 

About Kaiam Corporation
Headquartered in Newark, California, with large-scale manufacturing in Livingston, Scotland, Kaiam is a private company commercializing photonic integrated circuits. Founded in 2009 by leading technologists from the optical networking industry, the team has a record of delivering breakthrough products that change the rules of the marketplace. Current products include 40Gb/s and 100Gb/s optical transceivers optimized for datacentres. For more information, visit www.kaiam.com and follow on Twitter at: @KaiamCorp.


Kaiam Media Contact
Derek Milne
Communications Manager
Phone: +44 7734 137555
Email: d.milne@kaiamcorp.com


KaiamCorp

Kaiam is a vertically integrated provider of 40G and 100G+ transceivers and advanced PLCs for fiber optic communications. Kaiam's hybrid integration enables dense multi-lane interconnects for top-tier customers operating massive datacenters, next-generation broadband, and long-distance DWDM systems. Headquartered in California, Kaiam manufactures out of its wholly owned facility in Scotland.