Kaiam Demonstrates World’s First Complete 100Gb/s CWDM4 Silicon Photonics Transceiver at OFC 2016

MEMS-based coupling of CW lasers and Kaiam’s Planar Lightwave Circuit (PLC) technology complement highly integrated optoelectronics in a low-cost, high-performance CWDM module

ANAHEIM, CA — March 17, 2016 — Kaiam Corporation, a leader in hybrid Photonic Integrated Circuit (PIC) technology, is demonstrating the world’s first 100Gb/s CWDM4 silicon photonics transceiver at the largest global conference for optical communications, OFC 2016.

 

To showcase the capability of its industry-leading CWDM4 QSFP28 silicon photonics-based transceiver, Kaiam is conducting a live demonstration where the module is connected to a standard directly modulated laser version of the company’s CWDM4 transceiver through 10km of single mode fiber. The silicon photonics module combines all the high-speed electronics (modulator driver, TIA, and CDRs) together with high-performance silicon modulators and detectors in a single 3D chip stack. The wavelength multiplexing and demultiplexing is realized in the company’s glass-based PLCs, while the CW light is generated by InP lasers, coupled to the PLCs using Kaiam’s proprietary MEMS-based alignment technology. Standard grating couplers connect the glass PLCs to the silicon photonics IC.


"By combining Kaiam’s temperature-insensitive and low-cost PLC technology with silicon photonics ICs, we can bring benefits of electronic integration to applications requiring WDM interfaces. Our demonstration further shows that Kaiam’s MEMS approach is well suited for hybrid integration of a range of optical technologies from DMLs to silicon photonics." — Dr. Bardia Pezeshki

“Data center operators are continually looking for performance and cost improvements as many of them transition to WDM interfaces. This silicon photonics transceiver highlights that Kaiam has the tools available to deliver products in volume to meet and exceed our customers’ demands,” said Dr. Ron Kaneshiro, V.P. of Engineering at Kaiam.

 

Dr. Bardia Pezeshki, Kaiam’s C.E.O., added: “Each material system has its own strengths and weaknesses. Our technology allows us to combine the best materials for each function in a simple low-cost integrated module. For example, implementing wavelength multiplexing and demultiplexing in silicon photonics has traditionally been difficult in uncooled applications. By combining Kaiam’s temperature-insensitive and low-cost PLC technology with silicon photonics ICs, we can bring benefits of electronic integration to applications requiring WDM interfaces. Our demonstration further shows that Kaiam’s MEMS approach is well suited for hybrid integration of a range of optical technologies from DMLs to silicon photonics.”

 

To see the live demonstration, come by Kaiam’s booth #1222.

 

About Kaiam Corporation
Headquartered in Newark, California, with large-scale manufacturing in Livingston, Scotland, Kaiam is a private company commercializing photonic integrated circuits. Founded in 2009 by leading technologists from the optical networking industry, the team has a record of delivering breakthrough products that change the rules of the marketplace. Current products include 40Gb/s and 100Gb/s optical transceivers optimized for datacentres. For more information, visit www.kaiam.com and follow on Twitter at: @KaiamCorp.


Kaiam Media Contact
Derek Milne
Communications Manager
Phone: +44 7734 137555
Email: d.milne@kaiamcorp.com


KaiamCorp

Kaiam is a vertically integrated provider of 40G and 100G+ transceivers and advanced PLCs for fiber optic communications. Kaiam's hybrid integration enables dense multi-lane interconnects for top-tier customers operating massive datacenters, next-generation broadband, and long-distance DWDM systems. Headquartered in California, Kaiam manufactures out of its wholly owned facility in Scotland.