Kaiam CEO, Bardia Pezeshki, will be speaking at the SEMI European MEMS & Sensors Summit 2018, being held 19-21 September in Grenoble, France.
Session 4: MEMS and Sensors TECHNOLOGIES
14:00–16:00, Thursday, 20 September 2018
MEMS-Based techniques for alignment of single/mode hybrid optics
Bardia Pezeshki, CEO, Kaiam
Visit Kaiam at stand #560 and let us show you how DENSITY is our DESTINY.
ECOC is the leading European conference in the field of optical communication, and one of the most prestigious and long-standing events in this field. Here, the latest progress in optical communication technologies will be reported in selected papers, demo session, keynotes, workshops and special symposia.
Fiera Roma, The Exhibition & Congress Centre of Rome
ECOC – East Entrance
Viale Alexandre Gustave Eiffel 79, Roma
ECOC – North Entrance
Via Portuense 1645-1647, Roma
23–27 September, 2018
Visit Kaiam at Stand #436 to see our latest advancements, designed to keep lifting the cloud ever higher.
Karen Liu, Sr. Director of Product Marketing, is scheduled to present a paper during Session 2 of the Workshop:
Data Center Networks: Meeting the emerging requirements for capacity, cost, energy consumption and reach
Paper Title: Optimizing wavelength parallelism in advanced data center transceiver
Session 2: Silicon based WDM transceivers for transmissions between and across data centers?
Sunday, Sept. 17 — 11:00-13:00 — Room F3
Corning will be presenting a paper which was co-authored by several Kaiam engineers.
Presentation Title: Fiber-to-Waveguide Connector for Co-Packaged Optics
Session M.2.C: III-V/Si Hybrid Integration
Monday, 18 Sept — 17:30 — Room F3
SC Topic: Datacom and Computercom Hardware
Type: Integrated Optoelectronic Devices and Optical Processors
Visit ECOC website
L.A. CONVENTION CENTER — LOS ANGELES, CA, USA | MARCH 19-23, 2017
OFC is the largest global conference and exhibition for optical communications and networking professionals. For over 40 years, OFC has drawn attendees from all corners of the globe to meet and greet, teach and learn, make connections and move business forward. Join Kaiam on the exhibition floor at Booth #2953 to see how Kaiam’s LightScale™ hybrid integration enables dense multi-lane interconnects for top-tier customers operating hyperscale datacenters, next-generation broadband, and long-distance DWDM systems.
Kaiam CEO, Bardia Pezeshki, will speak at OFC 2017 Symposium:
Overcoming the Challenges in Large-Scale Integrated Photonics
13:30–15:50, 16:00–18:00 on Monday, 20 March
OFC Media/Analyst Lunch Panel:
Hyperscale Data Centers: Inside and Out
12:00–13:00 on Tuesday, 21 March — Room 308A
Pluggable Optics – How is the Ecosystem and Value Chain Changing?
15:30–16:00 on Wednesday, 22 March
Kaiam Sr. Director of Product Marketing, Karen Liu, will be moderating the following panel at the OSA Executive Forum where experts from different layers of the supply chain will discuss the above trade-offs and offer their perspectives on what are the best/most likely solutions to be adopted in the near future:
Panel #2: Trade-offs in Data Center Interconnect (DCI)
11:15 – 12:30 on Monday, 20 March
Lucas Soldano, Senior Design Engineer, will be presenting a paper:
Multi-wavelength 100Gb/s Silicon Photonics Based Transceiver with Silica mux/demux and MEMS-coupled InP Lasers
at the following session:
Practical Solutions to Transceiver Integration
13:00–15:00 on Wednesday, 23 March
Craig Ciesla, VP of Engineering, will be speaking at the following workshop:
OFC: III-V + Silicon: To Integrate or to Co-package?
15:30–18:30 on Sunday, 19 March
Location: Room 408B
Amanda Shepherd, Human Resource Manager—US, will be speaking at the following training program:
Work the Exhibit Hall like a Pro: How to leverage your time on the show floor to maximize impact for networking and the job search
10:00–12:00 on Tuesday, 21 March
ST PAUL’S – 200 ALDERSGATE CONFERENCE CENTRE, LONDON, UK | 04 OCTOBER 2016
Kaiam CEO, Bardia Pezeshki, will speak at theThe Financial Times Future of Manufacturing Summit.
Panel Discussion: Clusters, Knowledge and Innovation — Bringing Key Players Together
The session is scheduled from 14:10 to 14:55.
The panel will explore case studies, best practices and frameworks that create environments conducive to innovation in the manufacturing sector. In which key ways are partnerships and collaborations between government, academia and industry accelerating technological developments? Where is cross-industry collaboration and interdisciplinary thinking succeeding? How are clusters across the globe accelerating innovation, attracting investment and stimulating start-ups? What lessons can be learned from successful innovation clusters around the world? What role should the public sector play in shaping the innovation ecosystem? What type of support is needed and how can policies and regulation become true enablers of innovation? What will be the impact of Brexit in Britain’s start-ups, R&D and in the general tech and scientific communities? Learn more and register here.
CCD CONGRESS CENTER — DÜSSELDORF, GERMANY | SEPTEMBER 18 – 22, 2016
The ECOC Exhibition is the largest European optical communications event, and a key meeting place for those within the fibre optic communication technology industry. Join Kaiam on the exhibition floor at Stand #389 to see our latest innovations in 40G and 100G transceivers, and PLCs.
Kaiam CEO, Bardia Pezeshki, will participate on the ECOC 2016 Market Focus panel:
The Fracturing of the Ethernet Optics Market
Moderator: Chris Cole, Ethernet Alliance
Wednesday 21 September, 12:05-12:35
Also, Dr. Susannah Heck, Senior Design Engineer at Kaiam, will be presenting at:
Sunday, September 18, 09:00 – 18:00
Embracing diversity: hybrid integration for data center optics
presented from 12:10 – 12:30 by
Susannah Heck, Kaiam Corp.
ANAHEIM CONVENTION CENTER — ANAHEIM, CA, USA | MARCH 20-24, 2016
OFC is the largest global conference and exhibition for optical communications and networking professionals. Join Kaiam on the exhibition floor at Booth #1222 to see our latest innovations in optical transceivers and planar lightwave circuits.
FERIA VALENCIA — VALENCIA, SPAIN | SEPTEMBER 27 – OCTOBER 1, 2015
The ECOC Exhibition is the largest European optical communications event, and a key meeting place for those within the fibre optic communication technology industry. Join Kaiam on the exhibition floor at Stand #647 to see our latest innovations in photonic integrated circuits and PLCs.
LI KA SHING CONFERENCE CENTER — STANFORD UNIVERSITY | SEPTEMBER 14 – 16, 2015
The SPRC 2015 Symposium is an annual event hosted by the Stanford Photonics Research Center and attended by the local and international photonics community. Kaiam CEO, Dr. Bardia Pezeshki will present a talk on Embracing diversity – MEMS-based hybrid optical packaging that brings out the best of each technology.
L.A. CONVENTION CENTER — LOS ANGELES, CA, USA | MARCH 22-26, 2015
OFC is the world’s leading optical network and communications exposition. Join Kaiam on the exhibition floor at Booth #1751 to see our latest innovations in optical transceivers and photonic integrated circuits.
Dr. Bardia Pezeshki, C.E.O. of Kaiam, will be presenting at OFC Market Watch:
Market Watch Panel III: What’s New in Integrated Photonics Technologies?
Tuesday, March 24, 3PM – 5PM
Location: Expo Theater I
Hybrid integration: the low-cost scalable way to commercialize silicon photonics, III-Vs, and your favorite device
Dr. Bardia Pezeshki will also be presenting at a special symposium, Beyond The Gold Box: The Future of Integrated Optics:
Part II: Data Center Optical Techniques to Move Beyond the Gold-Box
Wednesday, March 25, 1PM – 3PM
Location: Room 408B
Embracing diversity – Interconnecting different materials and components for the lowest $/Gb
Highest performance and lowest cost optical functions are best obtained in the shortest time by using proven and mature building blocks. For example, we demonstrate how PLCs and MEMS can connect silicon photonics.
Next-Generation Optical Networks for Data Centers and Short-Reach Links II
MOSCONE CENTER, SAN FRANCISCO, CA, USA | FEBRUARY 10, 2015
Dr. Karen Liu, Kaiam’s V.P. of Marketing, will deliver an invited paper exploring the question Should optical links be parallel or serial? at the SPIE Photonics West Opto Conference.
OSA/OIDA HEADQUARTERS, WASHINGTON DC, USA | NOVEMBER 5, 2014
Dr. Karen Liu, V.P. of Marketing for Kaiam, will be speaking on The Advantages of Hybrid Integration at the OIDA Workshop on State of the Art Integrated Photonics. The workshop will examine the commercialization of components and subsystems and their applications, as opposed to purely research achievements in photonic integration. Applications across telecom and data center networks will also be discussed.
PALAIS DES FESTIVALS ET DES CONGRÈS — CANNES, FR | SEPTEMBER 21-25, 2014
Billed as The Leading Fibreoptic Forum, The ECOC Exhibition brings the world the latest in optical communications. Join Kaiam on the exhibition floor at Stand #531 (Rotunda Riviera, Ground Floor) to see our latest innovations in photonic integrated circuits and PLCs.
Also, Dr. Karen Liu, Kaiam’s V.P. of Marketing, will be presenting at Market Focus 2014:
Monday 22 September, 14:30 – 15:00
A path to aligning single-mode optics costs with market need
Karen Liu, Kaiam Corp.
MOSCONE CENTER — SAN FRANCISCO, CA, USA | MARCH 9-13, 2014
OFC is the world’s leading event for advancing optical solutions in Telecom, Datacom, computing and more. Join Kaiam on the exhibition floor at Booth #1735 to see our latest innovations in photonic integrated circuits.
Bardia Pezeshki, Founder & CEO of Kaiam Corp. will also be presenting a talk at OFC as part of the Workshop on Photonic Startups and Entrepreneurship:
Wednesday, March 12
3:30 PM – 5 PM
Expo Theater III – South, Exhibit Hall C
ICC LONDON EXCEL — LONDON, UK | SEPTEMBER 22-26, 2013
Billed as The Leading Fibreoptic Forum, The ECOC Exhibition brings the world the latest in optical communications. Dr. Bardia Pezeshki will deliver an invited paper:
High performance MEMS-based micro-optic assembly for multi-lane transceivers
Advanced transceivers generally require multi-lane approaches, which necessitates the integration of multiple subcomponents. The use of mature, generally available, and low-cost single element components such as EMLs, silica PLCs, and direct-mod DFBs, integrated in a hybrid fashion and optically aligned with MEMS, provides a practical solution.
View the full schedule of invited papers here.
SHERATON SUNNYVALE HOTEL — SUNNYVALE, CA | SEPTEMBER 13, 2013
Silicon Valley’s Premier Event for Product Realization, The Product Realization Group will host a technical panel discussion, Silicon Valley Product Realization – From Concept to Cash Flow moderated by Mike Cassidy, Columnist for the San Jose Mercury News. Dr. Bardia Pezeshki will be participating on this panel.