News & Events

Kaiam in the News

APRIL 19, 2017

Businesses willing to invest in UK despite Brexit

 

A US manufacturer of ultrafast telecoms equipment, a South African group making animal feed from fly larvae, and a German pioneer in high-tech building components – three businesses with little in common but for one thing: their willingness to invest in new UK manufacturing capacity despite the prospect of Britain’s imminent departure from the European Union.

 

Although they all acknowledge the risks surrounding Brexit, the three companies, US electronics group Kaiam, South Africa’s Agriprotein and LTG Lofts to Go, based in Hamburg, say that the UK’s skills base and capabilities in advanced manufacturing are enough to outweigh the disadvantages. Read the full story.

Optical Connections

MARCH 28, 2017

OFC 2017: Kaiam, Corning present co-packaged terabit photonic interconnect

 

Potential to reduce chip power consumption by half, say co-developers.

 

Kaiam and Corning showcased an optical engine and single-mode fibre interface connector suitable for co-packaging with a 12.8Tb/s switch chip at OFC 2017, last week. The partners say that by converting high-speed signals to optical within the switch package, this high-density engine has the potential to cut chip interconnect power consumption in half. Read the full story.

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SEPTEMBER 20, 2016

Kaiam launches LightScale2 transceiver platform at ECOC

 

Kaiam says its LightScale2 platform, launched at ECOC 2016 this week in Dusseldorf, Germany, uses a planar approach to combine multiple transmit and receive blocks in a very dense architecture. The approach promises better performance and scalability than standard TOSA/ROSA designs, the company asserts.

Kaiam is sampling CWDM4 100-Gbps QSFP28 optical modules based on this architecture and expects to deliver 200, 400 and higher transmission rate on-board optics via the platform in the future. Read the full story.

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Next Events

SEMI European MEMS & Sensors Summit

 

Kaiam CEO, Bardia Pezeshki, will be speaking at the SEMI European MEMS & Sensors Summit 2018being held 19-21 September in Grenoble, France.

 

Session 4: MEMS and Sensors TECHNOLOGIES
14:00–16:00, Thursday, 20 September 2018
MEMS-Based techniques for alignment of single/mode hybrid optics
Bardia Pezeshki, CEO, Kaiam

ECOC 2018, 23–27 September, Roma, Italy

 

Visit Kaiam at stand #560 and let us show you how DENSITY is our DESTINY.

 

ECOC is the leading European conference in the field of optical communication, and one of the most prestigious and long-standing events in this field. Here, the latest progress in optical communication technologies will be reported in selected papers, demo session, keynotes, workshops and special symposia.

 

Fiera Roma, The Exhibition & Congress Centre of Rome
ECOC – East Entrance
Viale Alexandre Gustave Eiffel 79, Roma

ECOC – North Entrance
Via Portuense 1645-1647, Roma

 

23–27 September, 2018

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