Published Articles

High Performance MEMS-Based Micro-Optic Assembly for Multi-Lane Transceivers

Pezeshki, B.; Heanue, J.; Ton, D.; Schrans, T. et. al.

 

Journal of Lightwave Technology (Volume: PP, Issue: 99) — February 20, 2014 — Abstract—Advanced transceivers generally require a multi-lane approach, which necessitates the integration of multiple subcomponents. The use of mature, generally available, and lowcost single element components such as electro-absorption modulated lasers (EMLs), silica planar lightwave circuits (PLCs), and direct-modulated distributed feedback lasers (DFBs), integrated in a hybrid fashion and optically aligned with microelectromechanical systems (MEMS) provides a practical solution. Standard bonding tools with positioning tolerances of approximately ten micrometers are used to populate a silicon microbench that incorporates micro-adjustable elements with various optical components. After diebonding, the positions of coupling microlenses are adjusted to correct for the poor diebond accuracy, and then these movable elements are fixed in place with built-in heaters and solder. The net result is highly uniform, manufacturable, and low loss coupling between the optical elements, with typically 1 to 2dB of loss. Using this packaging technique, we demonstrate a 40Gb/s four-channel (4x10Gb/s) DML-based transceiver and a 100Gb/s ten-channel (10x10Gb/s) EML-based transceiver for 10km and 80km reach respectively.
IEEE Xplore Digital Library

High Performance MEMS-Based Micro-optic Assembly for Multi-lane Transceivers

Bardia Pezeshki

 

Presented at ECOC 2013 — London, UK — September 24, 2013 — Advanced transceivers generally require multi-lane approaches, which necessitates the integration of multiple subcomponents. The use of mature, generally available, and low-cost single element components such as EMLs, silica PLCs, and direct-mod DFBs, integrated in a hybrid fashion and optically aligned with MEMS, provides a practical solution.
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Efficient Compact Tunable Laser for Access Networks using Silicon Ring Resonators

Gideon Yoffe, Trinh Nguyen, John Heanue & Bardia Pezeshki

 

Presented at OFC/NFOEC 2012 — Anaheim, CA — March 7, 2012 — A compact external-cavity tunable laser using an InP gain chip and a reflector chip containing silicon ring resonators is demonstrated. We obtain more than 5mW output power with tuning across the C-band.
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