Industrial Partnerships Tag

Another leap in Scottish-US technology collaboration LIVINGSTON, SCOTLAND, UK — February 10, 2016 — Kaiam Corporation, a leader in hybrid Photonic Integrated Circuit (PIC) technology, along with SU2P, announce that following a meeting between Sir Jim McDonald, Principal and Vice Chancellor of the University of Strathclyde and Bardia Pezeshki, CEO of Kaiam Corporation, Kaiam is delighted to confirm that the company has agreed to become an...

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New Family of Products Achieves High Aggregate Bandwidths in Dense Form Factors SAN JOSE and NEWARK, CA — September 19, 2011 — Sanmina-SCI Corporation (Nasdaq: SANM), a leading manufacturing solutions company making some of the world’s most complex and valuable optical, electronic and mechanical products, and Kaiam Corporation, a global manufacturer of high performance hybrid photonic integrated circuits (PICs), today announced a partnership to produce a...

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Enables High Performance, Compact QSFP Modules for Telecom and Datacom Using Opnext 1310Nm Lasers NEWARK, CA — March 3, 2011 — Kaiam Corporation, an emerging startup with a breakthrough optical integration technology will have a live demonstration of their QSFP transmitter and receiver optical subassemblies for 40GBASE-LR4 applications at OFC/NFOEC 2011 in Los Angeles. The 4 x 10Gb/s TOSA and ROSA deliver and receive a cumulative...

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